With over 10 years of Advanced Packaging Substrate handling experience, Brooks enables global OEM success at worldwide advanced packaging fabs through loading, mapping, handling & aligning bowed, warped, thick or thin substrates
High Value Problems and Innovation Opportunities in Advanced Packaging
Today’s fabs need a cost-effective automation solution that provides increased flexibility in handling wafers, tape frames, panels, die trays, transparent, warped, bowed, heavier and lighter wafers.
Extreme environment cleanliness is required for hybrid bonding and other advanced processes. Any surface particles and defects significantly reduce yield and increase final product cost.
With the variability in materials, todays fabs require advanced handling automation with real-time adaptability using machine vision and analytical capabilities.
